Technical Documents
Datasheets		Stencil presentation	Flip chip printing
Microengineered Stencil	High resolution glass mask	Microengineered stencil presentation	Stencil printing for flip chip packaging
Featured technical papers on stencil printing
Technological advances in fine pitch solder paste printing	Stencil printing technology for fine pitch Pb-free solder paste printing	Low Temperature Flip Chip printing of Isotropic Conductive Adhesives	Development of a Low Cost Low temp Flip Chip assembly process

Technical papers

Journal articles

1. S. Stoyanov, R. W. Kay, C. Bailey, M.P.Y. Desmulliez, “Computational Modelling for Reliable Flip-Chip Packaging at sub-100 micron pitch using Isotropic Conductive Adhesives”, Journal of Microelectronics Reliability, July 2007, Vol. 47, pp. 132-141.

2. R. Kay, S. Stoyanov, G. Glinski, C. Bailey, M. Desmulliez, “Ultra-Fine Pitch Stencil Printing for a Low Cost and Low Temperature Flip-Chip Assembly Process”, Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on], March 2007, Volume 30, Issue: 1, pp. 129-136, ISSN: 1521-3331

3. G.J. Jackson, M.W. Hendriksen, R.W. Kay, M.P.Y. Desmulliez, R.K. Durairai and N.N. Ekere, “Sub-process challenges in ultra-fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip-chip assembly applications”, Journal of Soldering & Surface Mount Technology, 2005, pp. 24-32, ISBN: 0954-0911

Conference Presentation Papers

4. T. Krebs, R. W. Kay, “Statistical Evaluation for Type-6 pb-Free Solder Paste Printing Down to 200-Microns Pitch”, China SMT Forum, Shanghai, March 2007

5. D. Manessis, R. Patzelt, A. Ostmann, R. Ascenbrenner, H. Reichl, R. Kay, E. de Gourcuff,” Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip-chip Bumping up to 60µm Pitch”,  IMAPS 2006 39th International Symposium on Microelectronics, October 8-12, 2006, San Diego, California USA

6. G. J. Jackson,  M. W. Hendriksen, R. K. Durairaj, N. N. Ekere, M. P. Y. Desmulliez, R. W. Kay, "Differences in the Sub-Processes of Ultra Fine Pitch Stencil Printing due to Type-6 and Type-7 Pb-free Solder Pastes used for Flip-chip", ECTC 2003, New Orleans, Louisiana, pp. 536-543, ISSN 0-7803-7991-5.

7 S. Stoyanov, R. Kay, C. Bailey, M. Desmulliez, M. Hendriksen, "Ultra-fine pitch flip-chip assembly using Isotropic Conductive Adhesives" Proceedings of the 5-th Electronics Packaging Technology Conference, EPTC 2003, December 10-12, 2003, Singapore pp. 797-802, ISBN: 0-7803-8205-6

8. R. W. Kay, E. de Gourcuff, M. P. Y. Desmulliez, G. J. Jackson, H. A. H. Steen, C. Liu, P. P. Conway, “Stencil Printing Technology for Wafer Level Bumping at Sub-100 Micron Pitch using Pb-Free Alloys”, 2005 55th IEEE Electronic Components and Technology Conference (ECTC),  Florida USA, pp. 848-854, ISBN 0569-5503, IEEE catalogue number 05CH37635.

9. M. P. Y Desmulliez, R.W. Kay, E. Abraham, G. Jackson, S. Stoyanov, C. Bailey, “Stencil printing at less than 100 micron pitch”, IEEE – EMAP 2004, Sixth International Conference on Electronic Materials and Packaging, pp. 22-27, ISSN 983-2514-86

10. R. W. Kay, M. P. Y. Desmulliez, S. Stoyanov, C. Bailey, R. K. Durairaj, N. N. Ekere, M. Hendriksen, F. Frimpong, B. Smith, D. Price, A. Roberts, M. Whitmore, P. Ongley, J. Gourlay, "A High Volume, Low Cost and Low Temperature MEMS Packaging Technology Based on a Flip-Chip Assembly Process", Micro.Tec, Munich, October 2003, pp.123-128, ISBN 3-8007-2791-9.